𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Limitations of Norris-Landzberg equation and application of damage accumulation based methodology for estimating acceleration factors for Pb free solders

✍ Scribed by Syed, Ahmer

Book ID: 120083214
Publisher: IEEE
Year: 2010
Weight: 249 KB
Category: Article
ISBN: 1424470269
DOI: 10.1109/ESIME.2010.5464546

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Multi-Physics Simulation and Exper

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Virtual prototyping advanced by statistic and stochastic methodologies

✍ Rzepka, Sven; Muller, Axel; Michel, Bernd 📂 Article 📅 2010 🏛 IEEE ⚖ 871 KB

[IEEE Multi-Physics Simulation and Exper

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Interconnection technologies for photovoltaic modules - analysis of technological and mechanical problems

✍ Wiese, Steffen; Kraemer, Frank; Betzl, Norbert; Wald, Dietmar 📂 Article 📅 2010 🏛 IEEE ⚖ 227 KB

[IEEE Multi-Physics Simulation and Exper

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - A linear analysis to overcome the numerical Cherenkov instability

✍ Assous, F.; Segre, J. 📂 Article 📅 2010 🏛 IEEE ⚖ 744 KB

[IEEE Multi-Physics Simulation and Exper

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - On the mechanical properties of Cu3Sn intermetallic compound through molecular dynamics simulation and nanoindentation testing

✍ Wen-Hwa Chen, ; Hsien-Chie Cheng, ; Ching-Feng Yu, 📂 Article 📅 2010 🏛 IEEE ⚖ 906 KB

[IEEE 2009 10th International Conferene

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Modelling of jet-impingement cooling for power electronics

✍ Rizvi, M. J.; Skuriat, R.; Tilford, T.; Bailey, C.; Johnson, C. M.; Lu, H. 📂 Article 📅 2009 🏛 IEEE 🌐 English ⚖ 834 KB

[IEEE 2009 10th International Conferene

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - The dynamic model of electrostatic torsion mirror with pull-in consideration for multiphysics behavior anticipation

✍ Yuheon Yi, ; Hiroyuki Fujita, ; Hiroshi Toshiyoshi, 📂 Article 📅 2009 🏛 IEEE 🌐 English ⚖ 713 KB