𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board

✍ Scribed by Ferguson, T.P.; Jianmin Qu,

Book ID: 126746613
Publisher: IEEE
Year: 2001
Weight: 578 KB
Category: Article
ISBN-13: 9780930815646
DOI: 10.1109/ISAOM.2001.916597

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