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[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - New developments in single pass reflow encapsulant for flip chip application

✍ Scribed by Liu, J.; Kraszewski, R.; Xin Lin, ; Wong, L.; Goh, S.H.; Allen, J.

Book ID: 126653257
Publisher: IEEE
Year: 2001
Weight: 620 KB
Category: Article
ISBN-13: 9780930815646
DOI: 10.1109/ISAOM.2001.916552

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