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[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Pb-free solder paste reflow window study for flip chip wafer bumping

✍ Scribed by Li Li, ; Yang Rao, ; Jong-Kai Lin,

Book ID: 126642387
Publisher: IEEE
Year: 2001
Weight: 739 KB
Category: Article
ISBN-13: 9780930815646
DOI: 10.1109/ISAOM.2001.916559

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