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[IEEE IEEE International Integrated Reliability Workshop, 1996. - Lake Tahoe, CA, USA (Oct. 20-23, 1996)] 1996 International Integrated Reliability Workshop Final Report - Thickness and temperature effects on TDDB for DC and dynamic stressing of thin oxide

โœ Scribed by Soh, S.-H.; Naidu, M.; Hwu, J.; Sadwick, L.


Book ID
111954383
Publisher
IEEE
Year
1996
Weight
449 KB
Volume
0
Category
Article
ISBN-13
9780780335981

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