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[IEEE IEEE 1998 International Interconnect Technology Conference - San Francisco, CA, USA (1-3 June 1998)] Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) - A manufacturable embedded fluorinated SiO/sub 2/ for advanced 0.25 μm CMOS VLSI multilevel interconnect applications

✍ Scribed by Pai, C.S.; Velaga, A.N.; Lindenberger, W.S.; Lai, W.Y.-C.; Cheung, K.P.; Baumann, F.H.; Chang, C.P.; Liu, C.T.; Liu, R.; Diodato, P.W.; Colonell, J.I.; Vaidya, H.; Vitkavage, S.C.; Clemens, J.T.; Tsubokura, F.

Book ID: 126600552
Publisher: IEEE
Year: 1998
Weight: 546 KB
Category: Article
ISBN-13: 9780780342859
DOI: 10.1109/IITC.1998.704745

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