𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Three test problems for the comparison of lossy transmission line algorithms

✍ Scribed by Ruehli, A.E.; Cangellaris, A.C.; Huang, H.-M.

Book ID: 127135984
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 234 KB
Edition: 11
Category: Article
ISBN-13: 9780780374515
DOI: 10.1109/epep.2002.1057947

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE IEEE 11th Topical Meeting on Elect

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Lossy transmission line passive macromodeling algorithm - three case studies

✍ Dounavis, A.; Elfadel, I.M.; Achar, R.; Nakhla, M.; Ruehli, A.E.; Huang, H.-M. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 284 KB

[IEEE IEEE 11th Topical Meeting on Elect

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Low cost plastic packaging for high-power limiters

✍ Coffman, Z.E.; Teti, R.J.; Miller, S.C.; Gribbons, M.A. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 396 KB

[IEEE IEEE 11th Topical Meeting on Elect

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Structure decomposition for hybrid analysis of multilayer interconnect systems

✍ Orhanovic, N.; Divekar, D.; Matsui, N. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 314 KB

[IEEE IEEE 11th Topical Meeting on Elect

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Novel organic chip packaging technology and impacts on high speed interfaces

✍ Garben, B.; Huber, A.; Kaller, D.; Klink, E.; Grivet-Talocia, S. 📂 Article 📅 2002 🏛 IEEE ⚖ 337 KB

[IEEE IEEE 11th Topical Meeting on Elect

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Closed-form expressions for the line parameters of co-planar on-chip interconnects on lossy silicon substrates

✍ Luoh, A.; Weisshaar, A. 📂 Article 📅 2002 🏛 IEEE ⚖ 336 KB

[IEEE IEEE 11th Topical Meeting on Elect

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - TOPLine: a delay-pole-residue method for the simulation of lossy and dispersive interconnects

✍ Grivet-Talocia, S.; Canavero, F.G. 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 231 KB