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[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Novel organic chip packaging technology and impacts on high speed interfaces

✍ Scribed by Garben, B.; Huber, A.; Kaller, D.; Klink, E.; Grivet-Talocia, S.

Book ID: 126655187
Publisher: IEEE
Year: 2002
Weight: 337 KB
Category: Article
ISBN-13: 9780780374515
DOI: 10.1109/EPEP.2002.1057921

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