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[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Modeling of spiral and meander lines in multilayer passive integration

✍ Scribed by Kelander, I.; Arslan, A.; Hurskainen, V.

Book ID: 115500725
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 235 KB
Edition: 11
Volume: 0
Category: Article
ISBN-13: 9780780374515
DOI: 10.1109/epep.2002.1057888

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