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[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - TOPLine: a delay-pole-residue method for the simulation of lossy and dispersive interconnects

✍ Scribed by Grivet-Talocia, S.; Canavero, F.G.

Book ID: 111922733
Publisher: IEEE
Year: 2002
Tongue: English
Weight: 231 KB
Edition: 11
Volume: 0
Category: Article
ISBN-13: 9780780374515
DOI: 10.1109/epep.2002.1057950

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