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[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - Development of a millimeter wave system-on-a-package utilizing MCM integration

✍ Scribed by Pham, A.; Laskar, J.; Krishnamurthy, V.; Bates, D.; Marcinkewicz, W.; Schmanski, B.; Piacente, P.; Sprinceanu, L.

Book ID: 118116346
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 234 KB
Edition: 2000, 9th ed.
Volume: 0
Category: Article
ISBN-13: 9780780364509
DOI: 10.1109/epep.2000.895545

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