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[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Chip package co-design of the RF front end with an integrated antenna on multilayered organic material

✍ Scribed by Bhagat, M.; McFiggins, J.; Venkataraman, J.

Book ID: 126627380
Publisher: IEEE
Year: 2002
Weight: 375 KB
Category: Article
ISBN-13: 9780780374515
DOI: 10.1109/EPEP.2002.1057892

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