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[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Closed-form expressions for the line parameters of co-planar on-chip interconnects on lossy silicon substrates

✍ Scribed by Luoh, A.; Weisshaar, A.

Book ID: 126764582
Publisher: IEEE
Year: 2002
Weight: 336 KB
Category: Article
ISBN-13: 9780780374515
DOI: 10.1109/EPEP.2002.1057946

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