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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Thermo-mechanical reliability analysis of 3D stacked-die packaging with through silicon via

✍ Scribed by Zhaohui Chen, ; Bin Song, ; XueFang Wang, ; Liu, Sheng

Book ID: 126757366
Publisher: IEEE
Year: 2010
Weight: 888 KB
Category: Article
ISBN: 1424481406
DOI: 10.1109/ICEPT.2010.5582479

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