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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Properties of TiN films deposited by atomic layer deposition for through silicon via applications

✍ Scribed by Wenjie Zhang, ; Jian Cai, ; Dejun Wang, ; Qian Wang, ; Shuidi Wang,

Book ID: 126622586
Publisher: IEEE
Year: 2010
Weight: 761 KB
Category: Article
ISBN: 1424481406
DOI: 10.1109/ICEPT.2010.5582384

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