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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Analytical (“mathematical”) modeling of the dynamic response of a printed circuit board (PCB) to an impact load

✍ Scribed by Suhir, E.

Book ID: 120818489
Publisher: IEEE
Year: 2010
Weight: 915 KB
Category: Article
ISBN: 1424481406
DOI: 10.1109/ICEPT.2010.5583788

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