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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Vibration durability modeling and dynamic response analysis of PBGA mixed solder joints

✍ Scribed by Zhou, Bin; Qiu, Baojun; En, Yunfei

Book ID: 115492851
Publisher: IEEE
Year: 2010
Weight: 688 KB
Volume: 0
Category: Article
ISBN: 1424481406
DOI: 10.1109/icept.2010.5582607

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