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[IEEE Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium - San Diego, CA, USA (10-12 Feb. 1988)] Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium - Package thermal resistance model dependency on equipment design

✍ Scribed by Andrews, J.A.

Book ID: 126721022
Publisher: IEEE
Year: 1988
Weight: 728 KB
Category: Article
DOI: 10.1109/SEMTHE.1988.10613

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