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[IEEE Exhibition - Singapore (2008.05.19-2008.05.23)] 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility - EMC characterization of modules

✍ Scribed by van Doorn, Marcel

Book ID: 111925547
Publisher: IEEE
Year: 2008
Weight: 265 KB
Volume: 0
Category: Article
DOI: 10.1109/apemc.2008.4559958

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