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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (2-4 Oct. 1995)] Proceedings of Electrical Performance of Electronic Packaging - Analysis and simulation of complex interconnect structures and power/ground distribution networks in MCM and PCB's

✍ Scribed by Yuan, F.Y.

Book ID: 120633851
Publisher: IEEE
Year: 1995
Weight: 50 KB
Category: Article
ISBN-13: 9780780330344
DOI: 10.1109/EPEP.1995.524857

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