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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Efficient SPICE macromodel for EMI analysis of electronic packages and high-speed interconnects

✍ Scribed by Shinh, G.; Nakhla, N.; Achar, R.; Nakhla, M.; Dounavis, A.; Erdin, I.

No coin nor oath required. For personal study only.

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