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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Simulation of coupled interconnects using waveform relaxation and transverse partitioning

✍ Scribed by Nakhla, N.; Ruehli, A.; Nakhla, M.; Achar, R.

No coin nor oath required. For personal study only.

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