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[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - Packaging and interconnect design and analysis using FDTD

✍ Scribed by Piket-May, M.; Thomas, K.; Gravrok, R.

Book ID: 126697632
Publisher: IEEE
Year: 1997
Weight: 362 KB
Category: Article
ISBN-13: 9780780342033
DOI: 10.1109/EPEP.1997.634045

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