𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - Importance of damping and resonance in thin-film integrated decoupling capacitor design

✍ Scribed by Bandyopadhyay, J.; Chahal, P.; Swaminathan, M.

Book ID: 126725414
Publisher: IEEE
Year: 1997
Tongue: English
Weight: 850 KB
Edition: 1997
Category: Article
ISBN-13: 9780780342033
DOI: 10.1109/EPEP.1997.634031

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - Packaging and interconnect design and analysis using FDTD

✍ Piket-May, M.; Thomas, K.; Gravrok, R. 📂 Article 📅 1997 🏛 IEEE ⚖ 362 KB

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - EMI and power delivery design in PC systems

✍ Herrell, D.; Beker, B. 📂 Article 📅 1997 🏛 IEEE ⚖ 371 KB

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - Numerical modeling of inductance for a distributed system

✍ Gravrok, R.; Byers, A.; Piket-May, M. 📂 Article 📅 1997 🏛 IEEE 🌐 English ⚖ 354 KB

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - The importance of inductance and inductive coupling for on-chip wiring

✍ Deutsch, A.; Smith, H.; Katopis, G.A.; Becker, W.D.; Coteus, P.W.; Surovic, C.W. 📂 Article 📅 1997 🏛 IEEE 🌐 English ⚖ 398 KB

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - Time domain multiconductor transmission line analysis using effective internal impedance

✍ Sangwoo Kim, ; Neikirk, D.P. 📂 Article 📅 1997 🏛 IEEE 🌐 English ⚖ 288 KB

[IEEE Electrical Performance of Electron

[IEEE Electrical Performance of Electronic Packaging - San Jose, CA, USA (27-29 Oct. 1997)] Electrical Performance of Electronic Packaging - Low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurations

✍ Koike, S.; Kaizu, K. 📂 Article 📅 1997 🏛 IEEE ⚖ 221 KB