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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (2-4 Oct. 1995)] Proceedings of Electrical Performance of Electronic Packaging - Coplanar bond wire interconnections for millimeter-wave applications

✍ Scribed by Krems, T.; Haydl, W.; Verweyen, L.; Schlechtweg, M.; Massler, H.; Rudiger, J.

Book ID: 124072385
Publisher: IEEE
Year: 1995
Tongue: English
Weight: 201 KB
Category: Article
ISBN-13: 9780780330344
DOI: 10.1109/EPEP.1995.524887

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