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[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (2-4 Oct. 1995)] Proceedings of Electrical Performance of Electronic Packaging - S-parameter analysis of flip-chip transitions

✍ Scribed by Vahldieck, R.; Jin, H.

Book ID: 126695053
Publisher: IEEE
Year: 1995
Weight: 227 KB
Category: Article
ISBN-13: 9780780330344
DOI: 10.1109/EPEP.1995.524886

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