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[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Nanopackaging: nanotechnologies and electronics packaging

✍ Scribed by Morris, J.E.

Book ID: 124154993
Publisher: IEEE
Year: 2006
Weight: 747 KB
Category: Article
ISBN-13: 9781424404889
DOI: 10.1109/HDP.2006.1707593

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