𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Study of assembling ZnO nanowires on AFM tips

✍ Scribed by Hu Siyan, ; Sang Wenbin, ; Zhu Zhenghui, ; Wang Bin, ; Min Jiahua,

Book ID: 120616900
Publisher: IEEE
Year: 2006
Weight: 375 KB
Category: Article
ISBN-13: 9781424404889
DOI: 10.1109/HDP.2006.1707614

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Conference on High Density Microsy

[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Nanopackaging: nanotechnologies and electronics packaging

✍ Morris, J.E. 📂 Article 📅 2006 🏛 IEEE ⚖ 747 KB

[IEEE Conference on High Density Microsy

[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Nonlinear behaviors of transducer dynamics for thermosonic bonding

✍ Lei Han, ; Jue Zhong, 📂 Article 📅 2006 🏛 IEEE ⚖ 599 KB

[IEEE Conference on High Density Microsy

[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Curvature-compensated CMOS bandgap reference with 1.8-V operation

✍ Wang Xichuan, ; Si Cuiying, ; Xu Xing, 📂 Article 📅 2006 🏛 IEEE ⚖ 367 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Design of a high performance microcontroller

✍ Hu Yue-li, ; Cao Jia-lin, ; Ran Feng, ; Liang Zhi-jian, 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 407 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Packaging influence on acceleration sensitivity of pyroelectric infrared detectors

✍ Gerlach, G.; Shvedov, D.; Norkus, V. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 578 KB

[IEEE 2005 Conference on High Density Mi

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Wetting Dynamics Study of Sn-Ag Solder during Reflow

✍ Song, Li; Bing, An; Tong-jun, Zhang; Yi-ping, Wu 📂 Article 📅 2005 🏛 IEEE ⚖ 183 KB