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[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Curvature-compensated CMOS bandgap reference with 1.8-V operation

✍ Scribed by Wang Xichuan, ; Si Cuiying, ; Xu Xing,

Book ID: 118036923
Publisher: IEEE
Year: 2006
Weight: 367 KB
Volume: 0
Category: Article
ISBN-13: 9781424404889
DOI: 10.1109/hdp.2006.1707559

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