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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Characterization of Low-Temperature Sintered Nanoscale Silver Paste for Attaching Semiconductor Devices

✍ Scribed by Bai, J.; Zhang, Z.; Calata, J.; Lu, G-q.

Book ID: 118176740
Publisher: IEEE
Year: 2005
Weight: 573 KB
Volume: 0
Category: Article
ISBN-13: 9780780392939
DOI: 10.1109/hdp.2005.251412

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