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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Wetting Dynamics Study of Sn-Ag Solder during Reflow

✍ Scribed by Song, Li; Bing, An; Tong-jun, Zhang; Yi-ping, Wu

Book ID: 121335247
Publisher: IEEE
Year: 2005
Weight: 183 KB
Category: Article
ISBN-13: 9780780392939
DOI: 10.1109/HDP.2005.251398

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