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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Vibration Simulation of Transducer System in Thermosonic Wire bonding

✍ Scribed by zhili, Long; lei, Han; hongquan, Zhou; yunxin, Wu; Jue, Zhong

Book ID: 121195829
Publisher: IEEE
Year: 2005
Weight: 526 KB
Category: Article
ISBN-13: 9780780392939
DOI: 10.1109/HDP.2005.251439

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