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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Experimental investigation on boiling heat transfer coefficient enhancement using grooves for cooling of electronic devices

✍ Scribed by Sathyabhama, A.; Prashanth, S. P.

Book ID: 127219134
Publisher: IEEE
Year: 2014
Weight: 565 KB
Category: Article
ISBN: 1479952672
DOI: 10.1109/itherm.2014.6892318

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