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[IEEE 2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM) - Singapore, Singapore (2014.6.2-2014.6.4)] 2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM) - Optimization of ISBD embedded SiGe layers to prevent delamination process for MOSFET applications

✍ Scribed by Wasyluk, Joanna; Yang Ge, ; Wurster, Kai; Lenski, Markus; Reichel, Carsten

Book ID: 127263518
Publisher: IEEE
Year: 2014
Weight: 519 KB
Category: Article
ISBN: 1479954268
DOI: 10.1109/istdm.2014.6874689

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