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[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - A damage-free sapphire substrate removal process to realize highly manufacturable wafer-level white LED package

✍ Scribed by Shimojuku, Miyuki; Kojima, Akihiro; Shimada, Miyoko; Tomizawa, Hideyuki; Akimoto, Yosuke; Furuyama, Hideto; Sugizaki, Yoshiaki; Shibata, Hideki

Book ID: 127301234
Publisher: IEEE
Year: 2013
Weight: 374 KB
Category: Article
ISBN: 1479908754
DOI: 10.1109/icsj.2013.6756103

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