✦ LIBER ✦

[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Study of mechanical properties of Cu through-silicon-vias (TSV) specimen using electrodeposition bath

✍ Scribed by Wang, Huiying; Cheng, Ping; Wang, Su; Wang, Hong; Yuan, Yang; Gu, Ting; Ding, Guifu

No coin nor oath required. For personal study only.

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