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[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Growth models of copper filling in through silicon via at different current density

✍ Scribed by Wang, Zhaoyu; Cheng, Ping; Wang, Hong; Guo, Honglei; Ding, Guifu; Zhao, Xiaolin; Li, Jianhua

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