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[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Cu balls and Cu-core balls for 3D packaging

✍ Scribed by Kawasaki, Hiroyoshi; Hattori, Takahiro; Roppongi, Takahiro; Soma, Daisuke; Kawamata, Yuji

Book ID: 126720893
Publisher: IEEE
Year: 2013
Weight: 399 KB
Category: Article
ISBN: 1479908754
DOI: 10.1109/ICSJ.2013.6756080

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