𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - 3D eWLB — Horizontal and vertical interconnects for integration of passive components

✍ Scribed by Wojnowski, M.; Sommer, G.; Pressel, K.; Beer, G.

Book ID: 121259755
Publisher: IEEE
Year: 2013
Weight: 710 KB
Category: Article
ISBN: 1479902330
DOI: 10.1109/ECTC.2013.6575873

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2013 IEEE 63rd Electronic Componen

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Second-harmonic nonlinearities in RF silicon integrated passive devices

✍ Frye, Robert; Liu, Kai; Melville, Robert 📂 Article 📅 2013 🏛 IEEE ⚖ 699 KB

[IEEE 2013 IEEE 63rd Electronic Componen

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Embedded capacitors in the next generation processor

✍ Min, Yongki; Olmedo, Reynaldo; Hill, Michael; Radhakrishnan, Kaladhar; Aygun, Ke 📂 Article 📅 2013 🏛 IEEE ⚖ 710 KB

[IEEE 2013 IEEE 63rd Electronic Componen

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Characterization and modeling of copper TSVs for silicon interposers

✍ Malta, D.; Gregory, C.; Lueck, M.; Lannon, J.; Lewis, J.; Temple, D.; DiFonzo, P 📂 Article 📅 2013 🏛 IEEE ⚖ 955 KB

[IEEE 2013 IEEE 63rd Electronic Componen

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Small diameter via filling electrodeposition by periodical reverse current

✍ Hayashi, Taro; Kondo, Kazuo; Saito, Takeyasu; Okamoto, Naoki; Yokoi, Masayuki; T 📂 Article 📅 2013 🏛 IEEE ⚖ 701 KB

[IEEE 2013 IEEE 63rd Electronic Componen

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Reliability characterization of Chip-on-Wafer-on-Substrate (CoWoS) 3D IC integration technology

✍ Lin, Larry; Yeh, Tung-Chin; Wu, Jyun-Lin; Lu, Gary; Tsai, Tsung-Fu; Chen, Larry; 📂 Article 📅 2013 🏛 IEEE ⚖ 902 KB

[IEEE 2013 IEEE 63rd Electronic Componen

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - An air-dielectric via structure for 20Gbps+ board connectors

✍ Wu, Xin; Dunham, David; Na, Nanju; Hejase, Jose A. 📂 Article 📅 2013 🏛 IEEE ⚖ 901 KB