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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Characterization and modeling of copper TSVs for silicon interposers

✍ Scribed by Malta, D.; Gregory, C.; Lueck, M.; Lannon, J.; Lewis, J.; Temple, D.; DiFonzo, P.; Naumann, F.; Petzold, M.

Book ID: 121207658
Publisher: IEEE
Year: 2013
Weight: 955 KB
Category: Article
ISBN: 1479902330
DOI: 10.1109/ECTC.2013.6575893

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