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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - An air-dielectric via structure for 20Gbps+ board connectors

✍ Scribed by Wu, Xin; Dunham, David; Na, Nanju; Hejase, Jose A.

Book ID: 121207656
Publisher: IEEE
Year: 2013
Weight: 901 KB
Category: Article
ISBN: 1479902330
DOI: 10.1109/ECTC.2013.6575723

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