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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Reliability characterization of Chip-on-Wafer-on-Substrate (CoWoS) 3D IC integration technology

✍ Scribed by Lin, Larry; Yeh, Tung-Chin; Wu, Jyun-Lin; Lu, Gary; Tsai, Tsung-Fu; Chen, Larry; Xu, An-Tai

Book ID: 126754666
Publisher: IEEE
Year: 2013
Weight: 902 KB
Category: Article
ISBN: 1479902330
DOI: 10.1109/ECTC.2013.6575597

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