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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Challenges of chip-to-package interaction for 22nm technology with ultra low k and Pb-free interconnects

✍ Scribed by Muzzy, Chris; Bisson, Richard; Cincotta, John; Degraw, Danielle; Engbrecht, Edward; Gill, Jason; Lustig, Naftali; McLaughlin, Karen; Ouimet, Sylvain; Ross, Joseph; Turnbull, David

Book ID: 121259753
Publisher: IEEE
Year: 2013
Weight: 779 KB
Category: Article
ISBN: 1479902330
DOI: 10.1109/ECTC.2013.6575602

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