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[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Optimization of TEM sample preparation methods by FIB for the increase of throughput

✍ Scribed by Shuqing Duan, ; Ruijuan Qi, ; Ming Li, ; Yanli Zhao, ; Liu Chen, ; Qinqin Yu, ; Guo, Annie; Chang, Venson; Wu, Jeff; Chien, Kary

Book ID: 126611870
Publisher: IEEE
Year: 2013
Weight: 855 KB
Category: Article
ISBN: 1479912417
DOI: 10.1109/IPFA.2013.6599134

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