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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - TSV technology for 2.5D IC solution

✍ Scribed by Wang, Meng-Jen; Hung, Chang-Ying; Kao, Chin-Li; Lee, Pao-Nan; Chen, Chi-Han; Hung, Chih-Pin; Tong, Ho-Ming

Book ID: 121289738
Publisher: IEEE
Year: 2012
Weight: 1004 KB
Category: Article
ISBN: 1467319643
DOI: 10.1109/ECTC.2012.6248842

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