𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Current distortions compensation method for frequency converters

✍ Scribed by Orha, I.; Oniga, S.

Book ID: 124149280
Publisher: IEEE
Year: 2012
Weight: 457 KB
Category: Article
ISBN: 1467347574
DOI: 10.1109/SIITME.2012.6384356

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - A Matlab tool for simulations of power resonant converters

✍ Taut, Adrian; Pop, Ovidiu 📂 Article 📅 2012 🏛 IEEE ⚖ 215 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Real-time sensor acquisition interfacing using MatLAB

✍ Bande, Vlad; Pop, Septimiu; Ciascai, Ioan; Pitica, Dan 📂 Article 📅 2012 🏛 IEEE ⚖ 275 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Study of glass transition temperature of electrically conductive adhesives

✍ Busek, David; Mach, Pavel 📂 Article 📅 2012 🏛 IEEE ⚖ 458 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Software in the Loop environment reliability for testing embedded code

✍ Muresan, Marius; Pitica, Dan 📂 Article 📅 2012 🏛 IEEE ⚖ 542 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering

✍ Geczy, Attila; Kvanduk, Biborka; Illes, Balazs; Illyefalvi-Vitez, Zsolt 📂 Article 📅 2012 🏛 IEEE ⚖ 421 KB

[IEEE 2012 IEEE 18th International Sympo

[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Spherical coordinates control system for accurate orientation of directional antennas

✍ Lita, Ioan; Visan, Daniel Alexandru 📂 Article 📅 2012 🏛 IEEE ⚖ 235 KB