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[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Study of glass transition temperature of electrically conductive adhesives

✍ Scribed by Busek, David; Mach, Pavel

Book ID: 124075166
Publisher: IEEE
Year: 2012
Weight: 458 KB
Category: Article
ISBN: 1467347574
DOI: 10.1109/SIITME.2012.6384364

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