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[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Thermocouple attachment methods for PCB profiling during Vapour Phase Soldering

✍ Scribed by Geczy, Attila; Kvanduk, Biborka; Illes, Balazs; Illyefalvi-Vitez, Zsolt

Book ID: 121220360
Publisher: IEEE
Year: 2012
Weight: 421 KB
Category: Article
ISBN: 1467347574
DOI: 10.1109/SIITME.2012.6384414

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