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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of cooling rate and solder volume on the formation of large Ag3Sn plates in Sn-Ag based solder joints

✍ Scribed by Zhou, Qiang; Huang, Mingliang; Zhao, Ning; Zhang, Zhijie

Book ID: 121492558
Publisher: IEEE
Year: 2012
Weight: 735 KB
Category: Article
ISBN: 1467316806
DOI: 10.1109/ICEPT-HDP.2012.6474868

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