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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal resistance analysis by numerical method for power device packaging

✍ Scribed by Wu, Hao; Chen, Ming; Gao, Liming; Li, Ming

Book ID: 120211825
Publisher: IEEE
Year: 2012
Weight: 917 KB
Category: Article
ISBN: 1467316806
DOI: 10.1109/ICEPT-HDP.2012.6474706

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